CondAlign is proud to announce the commercial launch of E-Align25!

Our technology team has been relentlessly working on developing the next generation of anisotropic conductive film, with a pitch of only 25 µm. The final result has the potential to deeply change the electronics industry! 

E-Align25 is the only electrically conductive adhesive on the market capable of cold bonding fine electronic devices and components, without the need for high temperature/pressure curing, during or after application.

Compared to other solutions available in the market, E-Align25 has better conductivity performance, reduced carbon footprint, while being cost-efficient and easier to apply.

Typical applications of E-Align25:

 ·   Printed electronics
 ·   Temperature sensitive substrates
 ·   Fine pitch flex cables and connectors
 ·   Fine pitch flexible displays
 ·   Thin electrical laminates